Brand new for Beta LAYOUT at Electronica is the introduction of “3D-MID prototypes.” Molded Interconnect Device (MID) is the production of moldings with integrated conductive structures. In mass production, these moldings are manufactured using injection molding techniques. For prototyping purposes, this method is not economically feasible. Coming soon, Beta LAYOUT will offer the ability to manufacture MID components in prototype and small batch quantities, including the production of formed components by 3D printing, metallic coating, laser patterning, selective metallization, and mounting.
This technology is economically viable for engineers and companies with prototype and low volume quantity requirements. Start of production is planned for the second quarter of 2015. For design of 3D-MID components, developers can download the free PCB - POOL® edition of layout software TARGET 3001! which will have extended design features.
With "Brd - to - 3D,” Beta LAYOUT presents a comprehensive 3D package for its customers. The complete virtual circuit board package can be created directly from an EAGLE *.brd file. Features include photo realistic images of the PCB, SMD stencil, and STEP file generation. In addition, a freely rotatable 3D view in PDF format is created which can be viewed using Adobe Reader. A link to order a laser sintered 3D model of the assembled PCB is provided, and a free 3D model is offered with PCB-POOL® prototype orders that can be used effectively for collision checking.
In addition, visitors to the Beta LAYOUT booth can receive information on the entire product range and services provided by Beta LAYOUT. These include PCB-POOL® - PCB prototype manufacture, PCB assembly, LASER STENCIL - SMD stencils, BETA – PROTOTYPES - 3D rapid prototyping, PANEL-POOL custom front plate manufacturing including color printing, and the BETA-eSTORE - tools and aids for prototype PCB assembly. www.beta-layout.com