Everything for Electronics
Nuts & Volts Magazine (May 2018)

Events, Advances, and News (05.2018)

By Jeff Eckert    View In Digital Edition  

Topics discussed include another “breakthrough” in fusion technology that promises to provide the world with clean, safe, cheap, inexhaustible power; technology that combines a microelectromechanical system (MEMS) with newly crafted metasurface lenses to produce a much more compact infrared light-focusing system; machines based on Intel’s “Skylake” Xeon Scalable Processor (Xeon SP) that span rack-and-blade units for several markets; the latest bare-bones model Raspberry Pi 3 Model B+; NXP Semiconductors will soon be offering its first IoT-on-a-chip device, which “significantly advances the future of edge computing;” Zink Holdings has incorporated a Zink printer into its POP 20 MP digital camera to produce 3.5 x 4.25 in Polaroid-style prints; successful creation of a stethoscope produced entirely with 3D printed parts and recycled plastic tubing; and IBM has again scored the top number of US patents.


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