Topics discussed include another “breakthrough” in fusion technology that promises to provide the world with clean, safe, cheap, inexhaustible power; technology that combines a microelectromechanical system (MEMS) with newly crafted metasurface lenses to produce a much more compact infrared light-focusing system; machines based on Intel’s “Skylake” Xeon Scalable Processor (Xeon SP) that span rack-and-blade units for several markets; the latest bare-bones model Raspberry Pi 3 Model B+; NXP Semiconductors will soon be offering its first IoT-on-a-chip device, which “significantly advances the future of edge computing;” Zink Holdings has incorporated a Zink printer into its POP 20 MP digital camera to produce 3.5 x 4.25 in Polaroid-style prints; successful creation of a stethoscope produced entirely with 3D printed parts and recycled plastic tubing; and IBM has again scored the top number of US patents.
Read This Article!
If you’re a subscriber and your subscription includes this issue of Nuts & Volts, you can read this article in our digital edition by clicking the blue icon in the upper right corner. Use the email address associated with your subscriber services account to login.
If you're a member of our Preferred Subscriber Network, not only will the magic blue icon let you read this article, but EVERY article in EVERY issue is yours to enjoy! Over a decades worth of content is stored in our digital archive!
If you’re not a subscriber, you can still view a few sample pages of our digital edition or subscribe here for full digital access and/or print delivery. Also, as you browse around our site, you will find selected articles have been posted in their entirety for you to enjoy.